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EXTECHighConcentrationDiamondWaferingBlades---高密度鉆石切割碟貨號描述包裝推薦用途：金屬基復合材料、鈦、熱噴涂涂料、印刷電路板、骨頭
EXTEC ® High Concentration Diamond Wafering Blades---高密度鉆石切割碟
| 貨號 | 描述 | 包裝 |
| 推薦用途：金屬基復合材料、鈦、熱噴涂涂料、印刷電路板、骨頭。 | ||
| 12200 | 3" Dia. x 0.006" Thickness x 1/2” Arbor (76 mm x 0.15 mm x 12.7 mm) | Each |
| 12205 | 4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm) | Each |
| 12210 | 5" Dia. x 0.015" Thickness x 1/2” Arbor (127 mm x 0.4 mm x 12.7 mm) | Each |
| 12215 | 6" Dia. x 0.020" Thickness x 1/2” Arbor (152 mm x 0.5 mm x 12.7 mm) | Each |
| 12220 | 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm) | Each |
| 12218 | 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm) | Each |
| 推薦用途：難切割的，磁性材料和非磁性材料。 | ||
| 12252 | 5" Dia. x 0.020" Thickness x 1/2” Arbor (127 mm x 0.5 mm x 12.7 mm) | Each |
| 12253 | 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm) | Each |
| 12254 | 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm) | Each |
EXTEC ® High Concentration EP Diamond Wafering Blades---EP型高密度鉆石切割碟
| 貨號 | 描述 | 包裝 |
| 推薦用途：高分子材料，橡膠，軟性、黏性材料。 | ||
| 12222 | 4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm) | Each |
| 12224 | 5" Dia. x 0.020" Thickness x 1/2” Arbor (127 mm x 0.5 mm x 12.7 mm) | Each |
| 12226 | 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm) | Each |
| 12228 | 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm) | Each |
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